kicad-libs/footprints/microSDSpring.kicad_mod

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(module microSDSpring (layer F.Cu) (tedit 5AEB23DD)
(fp_text reference REF** (at 7.112 0) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value microSDSpring (at 6.604 -11.176) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 16.764 -10.668) (end 15.748 -10.668) (layer F.SilkS) (width 0.15))
(fp_line (start 16.256 -12.7) (end 16.764 -12.7) (layer F.SilkS) (width 0.15))
(fp_line (start 16.764 -12.7) (end 16.764 -10.668) (layer F.SilkS) (width 0.15))
(fp_arc (start 36.576 -4.572) (end 15.748 1.524) (angle 32.62770306) (layer F.SilkS) (width 0.15))
(fp_line (start 0.508 1.524) (end 15.748 1.524) (layer F.SilkS) (width 0.15))
(fp_line (start 0.508 -12.7) (end 0.508 1.524) (layer F.SilkS) (width 0.15))
(fp_line (start 16.256 -12.7) (end 0.508 -12.7) (layer F.SilkS) (width 0.15))
(pad 6 smd rect (at 0.7 -0.875) (size 1.4 1.75) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 0.7 -6.675) (size 1.4 1.75) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 15.075 0.7 90) (size 1.4 1.75) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 15.95 -12.4 90) (size 1.4 1.75) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 12.45 0 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1) (clearance 0.05))
(pad 7 smd rect (at 12.45 -1.1 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1) (clearance 0.1))
(pad 6 smd rect (at 12.446 -2.2 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1) (clearance 0.1))
(pad 5 smd rect (at 12.446 -3.3 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1) (clearance 0.1))
(pad 4 smd rect (at 12.446 -4.4 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1) (clearance 0.1))
(pad 3 smd rect (at 12.446 -5.5 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1) (clearance 0.1))
(pad 2 smd rect (at 12.446 -6.6 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1) (clearance 0.1))
(pad 1 smd rect (at 12.446 -7.7 180) (size 1.5 0.7) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.1) (clearance 0.1))
)